====== Telecon Notes July 11, 2018 ======

Attendance: \\
Regrets: 

=== Agenda ===
   * Mechanical design of focal plane, {{:20180711_focalplane.pdf|}} (UMN)


=== Notes ===

PICO telecon, July 11, 2018

  * Toki: 1) focus should be at top of lenslets; 2) require an absorbing layer below the antennas to ensure broad band and high efficiency. Conceptually, can think of an array of spider webs right below the antennas. **UMN to work on these. (AI)**
  * For CADR, high heat capacity of Invar may not be a problem. **Check with Chris Paine and Peter Shirron (AI)**
  * Indium bump bonds are superconducting, not a great thermal conductor. ** check thermal conductance, calculate temperature gradient **
  * TDM chips will be fabricated on Si wafers, and bonded to detector wafers. **Replace PCB board by silicon (AI)**
  * Toki: check that the walls between the wafers doesn't interfere with the beam out of the lenslet. **Qi will check again after modification. (AI)**