Remaining key open areas: Thermal Design (JPL); Changing telecons to a lower cadence: two weeks?
Notes
Mechanical design of focal plane
Jamie shared the experience with Bicep3 focal plane:
heat sink: gold frames and wires around perimeter of wafer. They found contact resistance is the main issue. Biggest thermal impedance comes from between gold and silicon; at 100mK, conductance is mainly through electrons, pushing harder does not help.
4 clamps push down the wafers, but wafers can still slide; clamps don't short the instruments.
In theory, gold wires and bars play the role of RF shields.
PICO has a preliminary design, which can be used to estimate the mass already; more details about how to mount wafers on frames are ongoing
material of frame: copper vs invar? Jamie: invar has high capacity, large mount of magnetic material
bump bonds should be straightforward on PICO time scale
Karl knows the size of TDM, Qi to find out what Karl has concluded (AI)
Report writing
page 4, section 3 Instrument is most relevant
internal review
by the end of August
Thermal design
we don't have one yet, JPL is responsible.
No objection against changing the telecon cadence to 2 weeks.