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imagerteleconnotes20180131 [2018/01/31 13:49] – created kyoungimagerteleconnotes20180131 [2018/02/01 13:40] (current) kyoung
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 ====== Telecon 20180131 ====== ====== Telecon 20180131 ======
  
-Attending: +Attending: Brian, Julian, Hannes, Amy, Tom, Kris, Shaul, Karl, Qi, Roger, Graca 
  
-Notes by : \\+Notes by : Karl/Qi \\
  
 === Agenda=== === Agenda===
  
-  * Preparing the next Teamx-I +  * {{::teamxsummary.pdf|Preparing the next Teamx-I}} 
-  * Report on Systematics work +  * Report about systematics work (delayed to next week) 
-  * Cleaned up focal plane +  * Cleaned up focal plane {{::focalplane_update_20180131.pdf|version 4}} 
-  * GRASP+  * GRASP {{::bjohnson_01.24.17.pdf| status}}
      
 +  
 +=== Notes ===
 +
 +Preparing the next Teamx-I -- By learning from previous one.
 +  * response from TeamX, 90 slides on sub-systems. 
 +  * Section summaries in presentation. No cost discussion today. 15 pages in each sub-system.
 +  * Need to do homework on some items before next TeamX
 +  * Systems:
 +    * I&T will be analyzed in next teamX, was not analyzed here. Still marked as weakness due to complexity.
 +    * telescope systems at various temperatures (40 K, 4 K, 100 mK) make testing the end to end alignment challenging.
 +    * Will continue discussion with Bill J. and Tomo next week.
 +    * Definition: OGSE, optical ground support equipment. Testing equipment that doesn't fly.
 +    * Future threats: add “cost of cooler”  Comments: this is a cost threat more than a technology threat
 +  * FP and detectors
 +    * Str: TES have ground based heritage. detector 1/f shown to be acceptable. future options for MKIDS.
 +      * Roger will lead 1/f story for final report. Tomasso is running gain variation and per rotation calibration options (assuming 10 mHz 1/f knee)
 +      * General comment: detector 1/f isn't the only important 1/f term. Other issues (temperature stability) may dominate.
 +      * Only modulation is sky rotation and scan speed.
 +    * Weak + future threat: Impact of cosmic rays.
 +      * Jeff Fillipini has looked into this.  As has Roger.  Roger will lead report summary.
 +      * Work to reduce impact is also being done at Berkeley.
 +    * Hannes: What about optical coupling?
 +      * This hasn't been finalized.  Roger: coupling via lenslets hasn't been shown at high frequencies.
 +  * Electronics 
 +    * Weak: Temperature limits. 
 +      * TeamX assumed what is currently used. but would used space qualified electronics, so this won't be an issue
 +      * Amy: TeamX usually gives reports to science teams, not reviewers.  Amy is talking with TeamX/NASA to point out that reports need to be crafted so a general review audience understands the issues.  Easily address comments like this risk getting blown out of porportion.
 +  * Optics:
 +    * Weakness: maturity of mechanical and thermal design of focal plane.
 +      * this work is in progress for next TeamX
 +  * Thermal:
 +    * 3HE, testing for MIRI was expensive. even if those tests done for PICO, < $1M so ignore it. 
 +    * Cost is large. $900M for cooling, 50% of instrument cost.  This is largest thermal risk point.
 +  * Mechanical:
 +    * Strength: scalable, simple, nothing radical
 +    * Weakness: optics alignment complex.
 +      * Address by pointing out WMAP and Planck have done this successfully, should not be weakness, will address in next TeamX
 +  * Configuration
 +    * Threat: No volume margin for primary mirror inside the shade
 +      * Shaul: this is being worked on, should have some margin by next TeamX
 +
 +Focal Plane V4 (Karl)
 +  * simpler focal plane, 2 wafer sizes.
 +  * roughly 1000 more detectors at high frequency.  Sensitivity same. (0.61 uK vs 0.62)
 +  * FP could go further out in X,
 +  * Current reflectors need to be larger if we increase focal plane; but we can increase focal plane with current strehl limits.
 +  * Central wafer issues:
 +    * multi- and mono band pixels coexist
 +    * insufficient bond pads for number of bolos on this wafer.
 +      * 4000 bolos on 4" wafer.  Hannes: fit ~2000 bolos on 6" wafer in past.
 +      * We are assuming 100 um per bond pad. 4 inch wafer. 
 +  * 2 mm between tiles, may be too small. For EBEX, ~5 mm.  **Karl** to check
 +    * Roger to get spacing number from recent BICEP arrays
 +  * Kris: We need to think about how pixels are aligned to scan direction and how this impacts map making.
 +    * are we making single detector maps? multi detector maps? do pixels need to follow the same path on the sky as a neighbor?
 +    * This may require slight rotations of the focal plain.
 +
 +
imagerteleconnotes20180131.1517428179.txt.gz · Last modified: 2018/01/31 13:49 by kyoung