Campuses:
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| imagerteleconnotes20180131 [2018/02/01 13:39] – kyoung | imagerteleconnotes20180131 [2018/02/01 13:40] (current) – kyoung | ||
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| * multi- and mono band pixels coexist | * multi- and mono band pixels coexist | ||
| * insufficient bond pads for number of bolos on this wafer. | * insufficient bond pads for number of bolos on this wafer. | ||
| - | * 4000 bolos on 4'' | + | * 4000 bolos on 4" |
| * We are assuming 100 um per bond pad. 4 inch wafer. | * We are assuming 100 um per bond pad. 4 inch wafer. | ||
| * 2 mm between tiles, may be too small. For EBEX, ~5 mm. **Karl** to check | * 2 mm between tiles, may be too small. For EBEX, ~5 mm. **Karl** to check | ||