Campuses:
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| imagerteleconnotes20180620 [2018/06/20 13:21] – created hanany | imagerteleconnotes20180620 [2018/06/20 17:04] (current) – wenxx181 | ||
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| ====== Telecon 20180620 ====== | ====== Telecon 20180620 ====== | ||
| - | Attending: | + | Attending: |
| Notes by : Qi | Notes by : Qi | ||
| === Agenda === | === Agenda === | ||
| - | * Mechanical design of focal plane (Qi) | + | * {{:: |
| * 2-year, 4 detector, simulated maps available - next steps? (Kris) | * 2-year, 4 detector, simulated maps available - next steps? (Kris) | ||
| - | * Report Writing | + | * {{:: |
| + | * Remaining key open areas: **Thermal Design (JPL)**; Changing telecons to a lower cadence: two weeks? | ||
| + | |||
| + | === Notes === | ||
| + | Mechanical design of focal plane | ||
| + | * Jamie shared the experience with Bicep3 focal plane: | ||
| + | * heat sink: gold frames and wires around perimeter of wafer. They found contact resistance is the main issue. Biggest thermal impedance comes from between gold and silicon; at 100mK, conductance is mainly through electrons, pushing harder does not help. | ||
| + | * 4 clamps push down the wafers, but wafers can still slide; clamps don't short the instruments. | ||
| + | * In theory, gold wires and bars play the role of RF shields. | ||
| + | * PICO has a preliminary design, which can be used to estimate the mass already; more details about how to mount wafers on frames are ongoing | ||
| + | * material of frame: copper vs invar? Jamie: invar has high capacity, large mount of magnetic material | ||
| + | * bump bonds should be straightforward on PICO time scale | ||
| + | * Karl knows the size of TDM, **Qi to find out what Karl has concluded (AI)** | ||
| + | |||
| + | Report writing | ||
| + | * page 4, section 3 Instrument is most relevant | ||
| + | * internal review | ||
| + | * by the end of August | ||
| + | |||
| + | Thermal design | ||
| + | * we don't have one yet, JPL is responsible. | ||
| + | |||
| + | **No objection against changing the telecon cadence to 2 weeks.** | ||
| + | |||