Attending: Jamie, Brian, Tom, Shaul, Qi

Notes by : Qi

• Mechanical design of focal plane (Qi)
• 2-year, 4 detector, simulated maps available - next steps? (Kris)
• Report Writing
• Remaining key open areas: Thermal Design (JPL); Changing telecons to a lower cadence: two weeks?

• Mechanical design of focal plane
  • Jamie shared the experience with Bicep3 focal plane:
    • heat sink: gold frames and wires around perimeter of wafer. They found contact resistance is the main issue. Biggest thermal impedance comes from between gold and silicon; at 100mK, conductance is mainly through electrons, pushing harder does not help.
    • 4 clamps push down the wafers, but wafers can still slide; clamps don't short the instruments.
    • In theory, gold wires and bars play the role of RF shields.
  • PICO has a preliminary design, which can be used to estimate the mass already