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--- imagerteleconnotes20180711 [2018/07/11 14:00] – hanany
+++ imagerteleconnotes20180711 [2018/07/17 13:24] (current) – hanany
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 === Notes ===
+PICO telecon, July 11, 2018
+  * Toki: 1) focus should be at top of lenslets; 2) require an absorbing layer below the antennas to ensure broad band and high efficiency. Conceptually, can think of an array of spider webs right below the antennas. **UMN to work on these. (AI)**
+  * For CADR, high heat capacity of Invar may not be a problem. **Check with Chris Paine and Peter Shirron (AI)**
+  * Indium bump bonds are superconducting, not a great thermal conductor. ** check thermal conductance, calculate temperature gradient **
+  * TDM chips will be fabricated on Si wafers, and bonded to detector wafers. **Replace PCB board by silicon (AI)**
+  * Toki: check that the walls between the wafers doesn't interfere with the beam out of the lenslet. **Qi will check again after modification. (AI)**