Go to the U of M home page
School of Physics & Astronomy
Probe Mission Study Wiki

User Tools


imagerteleconnotes20180711

Differences

This shows you the differences between two versions of the page.

Link to this comparison view

Both sides previous revisionPrevious revision
Next revision
Previous revision
imagerteleconnotes20180711 [2018/07/11 16:46] wenxx181imagerteleconnotes20180711 [2018/07/17 13:24] (current) hanany
Line 12: Line 12:
 PICO telecon, July 11, 2018 PICO telecon, July 11, 2018
  
- +  * Toki: 1) focus should be at top of lenslets; 2) require an absorbing layer below the antennas to ensure broad band and high efficiency. Conceptuallycan think of an array of spider webs right below the antennas. **UMN to work on these. (AI)** 
-Toki: 1) focus should be at top of lenslets; 2) cavity below detector wafer, to avoid interference with antenna +  For CADR, high heat capacity of Invar may not be a problem. **Check with Chris Paine and Peter Shirron (AI)** 
-at least lambda/4 distanceabsorber to make broadband +  Indium bump bonds are superconducting, not a great thermal conductor. ** check thermal conductance, calculate temperature gradient ** 
-Honey cone could probably achieve cavity + connection. +  * TDM chips will be fabricated on Si wafers, and bonded to detector wafers. **Replace PCB board by silicon (AI)** 
-**UMN to work on these. (AI)** +  Toki: check that the walls between the wafers doesn't interfere with the beam out of the lenslet. **Qi will check again after modification. (AI)** 
- +
- +
-For CADR, high heat capacity of Invar may not be a problem. **Check with Peter Shirron (AI)** +
- +
-Indium superconducting, not good thermal conductor. +
-Thermal contraction between PCB and silicon; +
-**Replace PCB board by silicon (AI)** +
- +
-Toki: beam angle, wall. **Qi will check again after modification. (AI)** +
imagerteleconnotes20180711.1531345611.txt.gz · Last modified: 2018/07/11 16:46 by wenxx181