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--- imagerteleconnotes20180711 [2018/07/11 16:46] – wenxx181
+++ imagerteleconnotes20180711 [2018/07/17 13:24] (current) – hanany
@@ Line 12: / Line 12: @@
 PICO telecon, July 11, 2018
+  * Toki: 1) focus should be at top of lenslets; 2) require an absorbing layer below the antennas to ensure broad band and high efficiency. Conceptually, can think of an array of spider webs right below the antennas. **UMN to work on these. (AI)**
-Toki: 1) focus should be at top of lenslets; 2) cavity below detector wafer, to avoid interference with antenna
+  * For CADR, high heat capacity of Invar may not be a problem. **Check with Chris Paine and Peter Shirron (AI)**
-at least lambda/4 distance, absorber to make broadband
+  * Indium bump bonds are superconducting, not a great thermal conductor. ** check thermal conductance, calculate temperature gradient **
-Honey cone could probably achieve cavity + connection.
+  * TDM chips will be fabricated on Si wafers, and bonded to detector wafers. **Replace PCB board by silicon (AI)**
-**UMN to work on these. (AI)**
+  * Toki: check that the walls between the wafers doesn't interfere with the beam out of the lenslet. **Qi will check again after modification. (AI)**
-For CADR, high heat capacity of Invar may not be a problem. **Check with Peter Shirron (AI)**
-Indium superconducting, not good thermal conductor.
-Thermal contraction between PCB and silicon;
-**Replace PCB board by silicon (AI)**
-Toki: beam angle, wall. **Qi will check again after modification. (AI)**

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