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Telecon Notes July 11, 2018
Agenda
Notes
PICO telecon, July 11, 2018
UMN to work on these. (AI)
For CADR, high heat capacity of Invar may not be a problem. Check with Chris Paine and Peter Shirron (AI)
Indium bump bonds are superconducting, not a great thermal conductor. check thermal conductance, calculate temperature gradient
TDM chips will be fabricated on Si wafers, and bonded to detector wafers. Replace PCB board by silicon (AI)
Toki: check that the walls between the wafers doesn't interfere with the beam out of the lenslet. Qi will check again after modification. (AI)