Campuses:
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| ====== Telecon Notes July 25, 2018 ====== | ====== Telecon Notes July 25, 2018 ====== | ||
| - | Attendance: | + | Attendance: |
| Regrets: | Regrets: | ||
| === Agenda === | === Agenda === | ||
| - | * Mechanical design of focal plane, {{:20180711_focalplane.pdf|}} (UMN) | + | * Mechanical design of focal plane, {{:: |
| * Report - Technology Maturation Plan | * Report - Technology Maturation Plan | ||
| === Notes === | === Notes === | ||
| + | * Focal Plane (Qi) | ||
| + | * Jeff: beryllium could be something to consider as well, very light | ||
| + | * **Check with Tom about Through-wafer vias (AI)** | ||
| + | * Jamie: magnetic shielding? Shaul: no, out of scope | ||
| + | * thermal conductance of indium bumps seem surprisingly large. **Check thermal conductivity at 100 mK from phonons vs electrons (AI)** | ||