Telecon Notes July 25, 2018

Attendance: Roger, Bill, Jeff, Toki, Hannes, Jamie, Shaul, Qi

Regrets:

• Mechanical design of focal plane, 20180725_focalplane_progress.pdf (UMN)
• Report - Technology Maturation Plan

• Focal Plane (Qi)
  • Jeff: beryllium could be something to consider as well, very light
  • Check with Tom about Through-wafer vias (AI)
  • Jamie: magnetic shielding? Shaul: no, out of scope
  • thermal conductance of indium bumps seem surprisingly large. Check thermal conductivity at 100 mK from phonons vs electrons (AI)