Telecon 20180206
Attending: Brian, Roger, Jacques, Julian, Tom, Toki, Kris, Hannes, Shaul, Karl, Qi
Notes by : Karl/Qi
Agenda
Notes
Focal Plane Configuration
Focal Plane
change: 1)central wafer, split into three: F and GHI;2) 4mm space between edges of wafers based on different experiments (4.2mm for EBEX, 4-5mm for POLARBEAR, 5.5mm for BICEP)
Shaul: let's make space to 5mm
less F detectors, more GHI, same numbers for others
wire bonding
traditional: edge of wafer, constrains # you can bond; for F G H I, not enough space
“bump-bonding”, instead of the edge, you can wire bond the entire wafer, needed for GHI
readout
for TDM, 4 mm^2; for FDM, mainly due to large capacitors, 50-80 mm^2
FGHI need some special packing, working on
Cosmic Rays
Roger: signals long-time constant spikes
TES for X-rays, they do not see it as a driven issue; worth looking into it